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Please make use of this for the standardization and automation of your inspection processes!
Not only can we detect minute defects (foreign substances, scratches, etc.) that occur on transparent substrates such as sapphire, which have traditionally been difficult to inspect, but we can also automate and standardize the inspection process that has previously shown significant variability when done by the naked eye.
Introducing small glass substrate appearance inspection equipment and electronic component six-sided appearance inspection equipment.
Dainichi Shoji Co., Ltd. introduces the "Inspection Equipment" it handles. The "Wafer and Chip Appearance Inspection Equipment" achieves labor-saving with high-speed throughput and is capable of inspecting micro-cracks, foreign substances, and pattern defects. The "Small Glass Substrate Appearance Inspection Equipment" can detect minute scratches and dirt on small glass substrates such as those used in smartphones. Additionally, we also handle the "Electronic Component 6-Surface Appearance Inspection Equipment," which can perform high-speed inspection of chip components on six surfaces, processing approximately 1,500 units per minute. 【Wafer and Chip Appearance Inspection Equipment Features】 ■ Compatible with 2-inch to 12-inch sizes ■ Supports Si wafers, compounds, glass, etc. ■ Inspection of warped wafers and chips after dicing ■ Automatic discrimination function / Map data storage function ■ Resolution: 1.5μm *For more details, please refer to the PDF document or feel free to contact us.
